As we all know, the upcoming expected flagship chipset from Qualcomm is its Snapdragon 875G. There have been no leaks at all regarding this chipset yet. But today, we got some exciting news regarding the upcoming chipset.
Today, the digital blogger @mobile chip expert (on Weibo) has revealed a photo of the investment bank’s market research report on MediaTek and Qualcomm. The report also includes the upcoming Snapdragon 875G chipset and mentions that it will be based on Samsung’s 5nm EUV process. The chipset will be launched in the first quarter of 2021.
Moreover, The report includes not only the Snapdragon 875G but also some upcoming chipsets. There is an unknown SDM6853 chipset, which is based on a 7nm EUV process, set to be launched in the third quarter of the current year (2020). According to previous reports, SDM6853 should be Snapdragon 690. Then, in the fourth quarter, there are two (low to mid-range) chipsets, SD 662 and SD 460. The chipset “Snapdragon 662” has already been spotted on Geekbench many times with the codename “Bengal.”
Next, we have a new mid-range chipset, Snapdragon 735G, which is based on the same process as SD 875G. This chipset is expected to launch between the first and second quarter of 2021. There is also a low-end processor, the Snapdragon 435G, which will be launched after the Snapdragon 875G.
Moreover, the reports also include the upcoming MediaTek chipset. The upcoming chipsets from MediaTek are Dimensity 600 (for low to mid-range) and Dimensity 400 (entry-level chipset) with 7nm and 6nm based processes, respectively. The Dimensity 600 will be launched very soon, while the Dimensity 400 is expected in the first quarter of 2021.
Previously, it was reported that the new SD875 and X60 5G baseband have been sent officially for mass production to TMSC and are expected to be delivered in September. Moreover, the new chipset will use the core combination of Cortex X1 and Cortex-A78.
Currently, there is no more info regarding the upcoming chipset.
