Vivo Xplay6 was launched in November 2016. The phone comes with a 5.46-inch touchscreen display with a resolution of 2560 x 1440.
Vivo Xplay6 is powered by a quad-core Qualcomm Snapdragon 820 processor and comes with 6GB of RAM. The phone packs 128GB of internal storage, which cannot be expanded. As far as the cameras are concerned, the Vivo Xplay6 packs a 12-megapixel primary camera on the rear and a 16-megapixel front shooter for selfies.
Vivo Xplay6 runs Android 6.0 and is powered by a 4080mAh non-removable battery. It measures 153.60 x 73.40 x 8.20 (height x width x thickness) and weighs 178.00 grams.
Vivo Xplay6 is a dual SIM (GSM and GSM) smartphone that accepts Micro-SIM and Micro-SIM. Connectivity options include Wi-Fi, GPS, Bluetooth, FM, 3G and 4G. Sensors on the phone include the proximity sensor, accelerometer, ambient light sensor, and gyroscope.
Before the beginning of dismantling, the first step is removing the SIM slot to prevent damage to the fuselage in the disassembly process.
Remove two screws beside the Micro USB port.
The hyperbolic glass is pasted together with a white gasket and then secured with the metal back cover.
Insert a guitar pick between the back cover and fuselage, and then slide the pick along the edge of the fuselage.
After removing the back cover you can see the motherboard, battery and other internal parts, the motherboard was covered with a metal shield.
There is a large area of graphite thermal paste inside the back cover but no injection NFC antenna, which may still not have an NFC function.
The back cover and the middle frame are combined with a cover with a rubber strip, which not only makes the body tighter, but also prevents dust from entering the body.
The inner edge of the metal back cover has some antenna contacts.
The whole motherboard is almost all covered by a metal shield.
The interior design is the continuation of the more common three-stage design, but we found another mystery after dismantling, the design of the phone is more complex than any previous mobile phone.
The camera module is located in the center of the motherboard shield, and two cameras are mounted on a separate metal module. The flash is installed on the motherboard.
The top of the motherboard has some metal contacts.
The SIM card slot is also covered by a large area of the metal shield.
The bottom is the sub-board, fixed with the plastic baffle. From left to right, respectively, are the speaker, Micro-USB port, call microphone, and 3.5mm headphone jack.
Remove the plastic baffle can be seen after the sub-board, the speaker is located on the baffle, through the contacts with the sub-board.
The sub-board is relatively simple, with fewer chips, and the front has two cable interfaces.
First, remove the metal shield; the battery cable is under the metal shield.
Unscrew the screws to remove the metal shield. We can see most of the main chips on the motherboard are covered with the metal shield, and part of the shield is covered with copper foil to help heat dissipation.
There are some cables on the front of the motherboard. We will be removed one by one.
First, disconnect the battery cable to ensure that there will be no circuit damage due to a short circuit.
The battery is a lithium polymer battery with a capacity of 4000mAh and a nominal voltage of 3.85V.
The battery using double-sided adhesive fixed on the middle frame, first pull the label 1, and then pull the label 2, you can easily remove the battery down.
Disconnect all cables from the bottom board.
The back of the motherboard has a large metal shield and is covered with copper foil.
The TI BQ24192 is a battery charger IC.
Disconnect all cables from the motherboard and remove all screws securing the motherboard.
Removing the motherboard, the metal shield is covered with a large area of copper foil, and through the thermal grease connected to the middle frame, this design will better conduct heat to the middle frame to help dissipate heat.
The front of the Xplay6 motherboard also has two large copper foils.
Xplay 6’s with a 12MP and 5MP rear camera, the 12MP camera use the Sony IMX362 sensor, with a 4-axis OIS optical image stabilization, the lens aperture f / 1.7. Two cameras with glue attached to the metal frame are quite strong.
The front camera was 16 million, and it was equipped with a soft self-timer and soft light fixed on the motherboard.
After ripping the copper foil on the back of the motherboard, you can see the SoC chip with a lot of thermal greases.
Remove all metal shields from the motherboard.
Samsung’s K3RG6G6 0MMMGCJ LPDDR4 memory chip is located on the back of the motherboard. The capacity of 6GB, the following package Qualcomm MSM8996 Snapdragon 820, it uses the 14nm FinFET process, equipped with Adreno 530 graphics processor.
Qualcomm PM8996 power management IC
Samsung KLUDG8J1CB-B0B1 flash memory chip
ES9038Q2M Audio chip
Like the previous generation, the Xplay6 also uses three op-amps, but upgrades to the OPA1622, which is a Burr-BrownAudio amplifier from Texas Instruments. It is a widely used OPA1612 Upgraded version. Xplay6 audio circuit is rather unique, three op-chip arrangements in the sub-board, through the cable connected to the motherboard, intuitively seems to affect the sound quality?
Qualcomm WTR3925 LTE transceiver
Skyworks 77824-11 LTE power amplifier module
NXP TFA9890A is an audio chip that primarily serves Smart PA audio solutions with class-D amplifiers. Smart PA can greatly enhance the output power and improve the sound quality.
Qualcomm QCA6174A Wi-Fi and Bluetooth integration module
Qualcomm PMI8996 Power Management IC
Qualcomm WCD9335 audio decoder chip
RFMD RF7460 multi-mode multi-frequency PA module
