It is known that Honor is very nearing the launch of its Honor 50 Series. It is worth mentioning that this would be the first time Honor is releasing its main flagship phone after getting separated from Huawei. Today, some new developments have been revealed regarding the upcoming phone.
Recently, a Weibo blogger revealed the back render of the Honor 50. As you can see, the camera module is shaped much like the Huawei Nova 8’s camera bump.
The camera module consists of two circles. The first one contains a single primary camera sensor, while the second circle consists of two lenses. According to the blogger, this camera module design will be called the Cartier Ring Design. The blogger further mentioned that the color would be called Jifeng Blue.
Moreover, the famous Chinese blogger Digital Chat Station has also revealed that the new Honor 50 series will be released in June. It is tentatively scheduled to debut in the first half of the year.
Previously, it was reported that the Honor 50 series is expected to feature Qualcomm’s chipsets. The Honor 50 is expected to feature the Snapdragon 870 sub-flagship chipset, while the high-end version will use the Snapdragon 888 chipset.
The complete specifications list of the Honor 50 Pro+ is already live on our site, while the specifications of other versions are currently unknown.