Honor has officially announced that the company is about to release its first-ever foldable phone. Surprisingly, there have been no leaks or rumors ahead of the official release of the Honor Magic V, except for a patent that was revealed in July 2021.
As you can see from the official poster, the Honor Magic V foldable phone seems to have very thin bezels, which is not common in foldable phones, but since this is just a launch poster, we can’t confirm it yet.
Moreover, if the smartphone is the same as the device shown in the patent, it will feature a vertical folding solution. The patent mentions bezels, hinges, and electrical connect cables for the folding display.
According to sources, the Honor Magic V is expected to be released in January 2022 and will feature the Snapdragon 8 Gen 1 chipset. At the Snapdragon 8 Gen 1 chipset launch event, the Honor Terminal Co., Limited (Fang Fei) president stated that Honor’s next-generation flagship would also feature the chipset.
The Snapdragon 8 Gen 1 is based on Samsung’s 4nm manufacturing process. The chipset consists of eight cores: 1x Cortex-X2 Super core, 3x Cortex-A710 cores, and 4x Cortex-A510 cores. It also integrates the Adreno 730 GPU and X65 5G modem.
Currently, the aspects like specifications and pricing of Magic V are unknown, but they will be revealed soon.
