Oppo R9 Teardown

Oppo R9 smartphone was launched in March 2016. The phone comes with a 5.5-inch touchscreen display with a resolution of 1920 x 1080 pixels at a PPI of 367 pixels per inch.

The Oppo R9 is powered by a 2.0GHz MediaTek Helio P10 octa-core processor, and it comes with 4GB of RAM. The phone packs 64GB of internal storage that can be expanded up to 128GB via a microSD card. As far as the cameras are concerned, the Oppo R9 packs a 16-megapixel primary camera on the rear and a 16-megapixel front shooter for selfies.

The Oppo R9 runs Android 5.1 and is powered by a 2850mAh non-removable battery. It measures 151.8×74.3×6.6mm and weighs 145.00 grams.

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Tools needed: Screwdriver, tweezers, crowbar, suction cup, guitar pick

Remove the SIM card tray with an E-ject pin.

SIM1: Nano-SIM
SIM2/TF: Nano-SIM & T-card

Remove two screws beside the Micro-USB port.

Now use the suction cup to suck the front panel of the phone and open a rip. Use the guitar pick to insert it in the rip and move it up and down. When the side is totally open, the back cover is free to go.

The back cover was removed.

Remove seven screws securing the motherboard.

Remove two metal brackets.
Disconnect the battery connector (green), Micro-USB cable (light blue), LCD cable (red), vibrator cable (pink) and RF antenna (yellow).

Lift up and remove the motherboard.

Remove the rear camera and front camera from the motherboard.

The front camera is 16MP, has an aperture of 2.0, was assembled by SUNNY, and the model is D4S01A.

The rear camera, which is 13MP, aperture 2.0, and PDAF, was assembled by SUNNY, and the model is F13S04Q.

Remove the metal shield from the motherboard.
There is a layer of Insulating tape and thermal silica in the metal shield.

SoC: CPU: MTK MT6755V, 8-core, 64-bit, Cortex-A53, Main Frequency 2GHz; GPU: Mali-T860, Dual core 64 bit, 700MHz

RAM & ROM: SEC「Samsung」, KMRC10014M, RAM: 4GB; ROM: 64GB

SPEAKER DRIVER IC: NXP TFA9890A, high-efficiency class-D audio amplifier with a sophisticated speaker boost and protection algorithm

GPS/Wi-Fi/BT/FM IC: MTK, MT6625LN, Dual Frequency Wi-Fi/BT 4.0/GPS/, GLONASS/FM

POWER AMPLIFIER MODULE： Skyworks, 77463-11, Supports WCDMA, High-Speed Downlink Packet Access, High-Speed Uplink Packet Access, High-Speed Packet Access and TD-SCDMA modulations

RF TRANSCEIVERS: MTK MT6176V

POWER MANAGEMENT IC 1: MTK MT6351V

POWER MANAGEMENT IC 2: MTK MT6311DP

CHARGE MANAGEMENT IC: TI BQ24196, 2.5-A Single Cell USB/Adapter Charger with Narrow VDC Power Path Management and USB OTG

Remove nine screws securing the speaker and bottom board.

Remove the speaker and bottom board.

Here’s the Oppo R9 speaker module.

Remove the battery.

The battery cells come from Amperex Technology Limited;

Battery capacity: 2850mAh / 10.83Wh (TYP); the rated voltage of 3.80V; Charging voltage limit of 4.35V.

Remove two screws securing the metal shield.
Remove the metal shield, earpiece, and motor.

The fingerprint identification module comes from Fingerprint Cards AB, and the model is FPC1245.

Heat up the display assembly for about 3-5 minutes.

Remove the display assembly.

TP IC comes from Synaptics.

Remove the touch button.

Here’s the touch button FPC.