Meizu Mobile PhoneMeizu MX6
Meizu MX6 Teardown
Meizu MX6 is powered by MediaTek Helio X20 processor with 4GB RAM + 32GB ROM combination, using 5.5 inches 1080P resolution screen, with a front 5-megapixel camera and a 12 million pixel Sony IMX386 rear camera sensor, support for fingerprint recognition and VoLTE. Built-in a 3060mAh battery, support for fast charging.
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Before starting the disassembly process, we need to remove the SIM card tray first.
Remove two screws beside the USB Type-C port.
Now, lift up the display assembly a little bit with a suction cup.
Insert a crowbar between the display and the middle frame to unlock all the snaps that secure the display.
When all the snaps are unlocked, lift up the display a little bit. There are two cables still connecting to the motherboard.
To avoid the mTouch cable connector being loose, MX6 uses a metal bracket. The bracket screws are covered with a fragile sticker to prevent the user from disassembling his phone.
Remove two screws securing the metal bracket and disconnect the mBack button cable.
Remove all screws securing the metal bracket and disconnect the video cable.
Now, you can remove the display assembly.
Remove two screws securing the metal bracket. You can remove the mBack button.
Around the touch button, there is a waterproof rubber ring to prevent the penetration of moisture inside the fuselage.
The 3.5mm headphone jack and Type-C port are fixed by two screws.
Remove eight screws that secure the plastic piece.
Remove these two plastic pieces.
Remove all screws securing the motherboard. You can remove the motherboard.
The vibrator module is connected to the main board via a spring.
Now, heat up the battery with a heat gun. Then, lift up the scotch tape to remove the battery.
MX6 built-in a 3060 mAh battery, with charging IC from Texas Instruments, MediaTek PEP fast charge program, the charging speed is very fast.
3.5mm headphone jack, microphone, antenna connector, and USB Type-C port
The MX6 is the world’s first phone to use Sony’s IMX386 sensor, with 12 megapixels, f/2.0 aperture, unit pixel size of 1.25μm, and PDAF phase focus support.
The front camera sensor model is OV5695, 500 megapixels, and supports FotoNation 2.0 and more.
MX6 uses a black PCB board. The main chip is covered with a metal shield.
On the other side of the board, it is also covered by a layer of thermal grease.