Realme GT Neo3 will feature Dimensity 8100 chipset, independent GPU, UFS 3.1, and LPDDR5

This morning, Realme’s VP (Xu Qi) revealed that the Realme GT Neo3 will feature the Dimensity 8100 chipset and Independent GPU chip. Both have lower power consumption and more powerful performance, and the gaming experience will be excellent.

It is worth mentioning that the Dimensity 8100 chipset is based on a 5nm TSMC process and has a higher frequency than the Dimensity 8000. The chipset consists of eight cores, including four Cortex-A78 cores and four Cortex-A55 cores. The GPU is Mali-G610.

The device also has LPDDR5 memory and UFS 3.1 storage, which are currently the best in the industry.

As reported earlier, the Realme GT Neo3 will feature a 6.7-inch AMOLED display with a single punch-hole and supports Full-HD+ resolution with a high refresh rate. There might be two battery versions: a 4500mAh battery with 150W charging and a 5000mAh battery with 80W charging.

The smartphone would feature a triple 50MP+8MP+2MP camera setup, with the 50MP lens being the Sony IMX766 with OIS. On the front, there would be a single 16MP lens.

The Realme GT Neo3 will be launched on March 22 at 2 PM.