LeaksNews

Redmi K30S spotted on TENAA with full specifications

This morning, the Redmi K30S was spotted on the TENAA certification site. The certification revealed all specs of the phone. This device has the model number M2007J3SC, which has already been spotted on many certification sites.

 

The certification mentioned that the Redmi K30s would feature a single punch-hole 6.67-inch Full-HD+ 2400×1080 LTPS IPS display. The display has a 16.7M color depth and may also support a 144Hz refresh rate. The phone has total dimensions of about 165.1×76.4×9.33 mm and weighs around 216g.

The phone will be powered by the Snapdragon 865 chipset, which is an octa-core chipset with a maximum frequency of 2.84 GHz. The chipset name is confirmed from the previous Geekbench of this model.

It would be available in three RAM variants and three storages: 6GB, 8GB, and 12GB with 128GB, 256GB, and 512GB. The phone has a quad-camera setup with a main 64MP primary sensor, while the front camera uses a 20MP sensor. The camera bump is a lot similar to the Mi 10T Pro’s camera bump. This phone is also equipped with a side fingerprint scanner.

The phone would feature a 4900mAh battery with fast charging support. It will also support a dual-SIM 5G Network.

This device may not be limited to China as it will feature Qualcomm’s Snapdragon 865, while the devices with Dimensity chipsets are currently limited to China.

Harris Zahid

I'm a tech enthusiast, writer at MyFixGuide.com, having a great Interest in Auto Industry And All Communications Related Equipment. Photography and Gaming are my Hobby too. For any query, contact me at h.zahid@myfixguide.com.

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