Qualcomm Snapdragon 898 and MediaTek Dimensity 2000 chipset specifications revealed

This afternoon, the famous Chinese blogger Digital Chat Station shared a significant update in the smartphone industry. The blogger has revealed the specifications of Qualcomm Snapdragon 898 and MediaTek Dimensity 2000.

The blogger said the Snapdragon 898 would be based on Samsung’s 4nm manufacturing process and feature one Cortex-X2 super core clocked at 3.0GHz, three performance cores clocked at 2.5GHz, and four energy-efficient cores clocked at 1.79GHz. It will also feature an Adreno 730 GPU.

The Dimensity 2000 will be based on a 4nm TMSC’s manufacturing process and feature the same one Cortex-X2 super core clocked at 3.0GHz, three performance cores clocked at 2.85GHz, and four energy-efficient cores clocked at 1.8GHz. This chipset will feature a Mali-G710 MC10 GPU.

Judging from the frequency, we can expect the Dimensity 2000 to provide a more powerful performance. It is also expected that the high-performance core of both chipsets will be the Cortex-A710 core, while the energy-efficient core will be the Cortex-A510 core.

It was also reported that the Snapdragon 898 chip might be available as soon as possible in the second quarter of next year. Many smartphone models from different manufacturers are already scheduled to be powered by the Snapdragon 898 chipset.

In July, MediaTek officially revealed that it would announce the successor chipset of its main flagship series before the end of this year.

They also stated that this chipset would be based on ARM’s latest flagship core and the industry’s best TSMC 4nm process, which would help the chipset to provide the industry’s leading low-power consumption with excellent performance in addition to Advanced AI, multimedia IP and exclusive Dimensity 5G open architecture would provide differentiation.

It is also reported that Mediatek is currently collaborating with different smartphone manufacturers to test this flagship chipset. The mass production of the chipset may start in 1Q22, and a range of products featuring the chipset will be launched.