Qualcomm Snapdragon 875G, 735G, 435G, 690, 662, 460, and MediaTek Dimensity 600, 400 are on the way

As we all know, Qualcomm’s upcoming flagship chipset is the Snapdragon 875G. There have been no leaks regarding this chipset yet, but today, we have some exciting news.

Today, a digital blogger revealed a photo of the investment bank’s market research report on MediaTek and Qualcomm. The report also includes the Snapdragon 875G chipset and mentions that it will be based on Samsung’s 5nm EUV process. The chipset will be launched in the first quarter of 2021.

The report includes the Snapdragon 875G and some upcoming chipsets. The unknown SDM6853 chipset based on a 7nm EUV process will be launched in the third quarter of this year. According to previous reports, SDM6853 should be Snapdragon 690. Then, in the fourth quarter, there are two (low to mid-range) chipsets, SD 662 and SD 460. The Snapdragon 662 has been spotted on Geekbench with the codename Bengal.

Next, we have a new mid-range chipset, Snapdragon 735G, which is based on the same process as SD 875G. This chipset is expected to launch between the first and second quarters of 2021. There is also a low-end processor, Snapdragon 435G, which will be launched after the Snapdragon 875G.

The reports also include the upcoming MediaTek chipset, including the Dimensity 600 and Dimensity 400. The Dimensity 600 will be launched very soon, while the Dimensity 400 is expected in the first quarter of 2021.

Previously, it was reported that the new SD875 and X60 5G baseband have been sent officially for mass production to TMSC and are expected to be delivered in September. The new chipset will use the core combination of Cortex X1 and Cortex-A78.

Currently, there is no more info regarding the upcoming chipset.