Recently, a netizen exposed Sony’s new smartphone – the Xperia H8216, and released a leaked picture of the phone’s specification in a Reddit forum.
From the leaked picture, the phone will come with a 5.48-inch FHD screen with a resolution of 1,920 pixels by 1,080 pixels and powered by an octa-core Qualcomm Snapdragon 845. It features a 15MP front shooter for selfies and a 12MP and 12MP dual camera setup on the rear. The H8216 will come with 4GB of RAM and 64GB of ROM.
It will sport a 3,130mAh battery (unsure) and run on Android 8.1. The phone measures 148×73.4×7.4mm and weighs 156g. It will support rated IP65/68 dustproof and waterproof.
The Xperia H8216 is considered Sony’s next flagship, and it is estimated to be launched in 2018. As the Sony XZP is the first smartphone to be powered by Snapdragon 835, it will be the first phone to be powered by Snapdragon 845.
