This morning, Xiaomi officially announced that the Xiaomi Civi 3 is coming soon and will be powered by Dimensity 8200 Ultra chipset. The chipset is probably the overclocked version of Dimensity 8200, released in December 2022. As the officials said, the chipset will be upgraded in terms of performance and imaging.
The Dimensity 8200 is based on a 4nm manufacturing process and features the following cores: 4x Cortex-A78 performance cores (one core at 3.1GHz and three cores at 3.0GHz) and 4x Cortex-A55 energy-efficient cores at 2.0GHz.
According to previously leaked information, the Xiaomi Civi 3 will feature a dual punch-hole display that supports Full-HD+ resolution and 120Hz refresh rate. Inside the dual punch-hole is a combo of 32MP lenses (Samsung S5KGD2) for selfie shooting.
On the back, the Civi 3 is expected to feature a triple camera setup, with the primary camera expected to be the 50-megapixel Sony IMX800 lens. According to the 3C certification, the smartphone will have a 4500mAh battery and support 67W fast charging.
The company still hasn’t revealed the launch date. However, the launch is expected to happen soon, and the officials will also announce the date in the coming days.