After removing the motherboard, we found a large hole where the main chip was placed to help with better heat dissipation. However, such a design can cause difficulties in processing.
The most important components on the motherboard, including the CPU and RAM, are covered with nanometer carbon copper, which is compatible with heat dissipation and conductive functions. This material can solve both heat dissipation and shield problems.
It is the front of the motherboard. The white part on the left top corner is a voice-generating device of the ultrasonic distance sensor, and the semicircle part on the right is the receiver. The distance between the face and a phone can be calculated via a series of algorithms in this area.
It is the back of the motherboard.
Details of the motherboard’s back area
With the 8GB LPDDR4 memory chip removed, the Snapdragon 845 processor can be seen.
The hidden earphone uses a 50mv large core. It will work as an auxiliary component to the loudspeaker to increase the whole device’s volume.
Take out the earphones. It is the internal structure without the earphone.
Heat up and remove the front plate. A decoration bar is designed on the front plate to protect the LCD module and TP.
We found that this front plate uses PA high fiber with high intensity after using infrared spectroscopy to analyze it. Compared with glass fiber PC, PA has better hardness and size stability. Xiaomi adds this component to improve the full-screen phone’s hardness.
We can see the internal structure of the hidden earphone and ultrasonic distant sensor- three independent acoustic seal cavities.
It is a sound induction tube.
Front and rear camera
Front and rear camera size
Now, let’s take a look at the core components of the phone. Throughout the teardown, we found that the Xiaomi Mi MIX 2S applies some new designs to its internal structure thanks to its full-screen design. Placing an ultrasonic system, high-powered headphones, and dual rear cameras with OIS support in the cramped top space presents a great challenge for the phone.
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