Xiaomi has officially launched its Mi MIX 2S. This phone continues to adopt the design that the Mi MIX 2 uses, and it boasts a full-screen 2.0 with narrowed bezels on both sides. The phone features a dual-rear vertical setup and a fingerprint reader on the back. The MIX 2S boasts a four-sided curved ceramic back plate to deliver an amazing hand feel.
Since it boasts of such an excellent appearance design, how about the phone’s workmanship on its internal design? Today, we will take apart the MIX 2S to explore its internal structure.
This is the phone’s appearance design on the back. It features a four-sided curved ceramic back plate and brings good texture. With AF fingerprint-proof coating on the back, basically, no fingerprint will be left on the phone.
The phone’s ceramic back cover is surrounded by glue. Heat up and use a pick to remove the back cover.
When removing the ceramic battery cover, slowly open it from one side to avoid disconnecting the fingerprint ribbon cable. After removing the back cover, we can see a wireless charging coil. NFC antenna is placed on the wireless charging coil.
It is the phone’s back cover. The battery cover adopts gum and plastic snap joint design but does not completely use gum.
This is a fingerprint reader module on the back.
The phone’s rear dual vertical camera lens is made of scratch-resistant sapphire glass with a hardness of 9H. For protection purposes, the perimeter metal bracket of the lens is approximately 0.05 mm higher than the glass.
Xiaomi’s ceramic battery cover is made of a new tetragonal system ceramic material, which can better enhance the hardness of the phone.
Upon removing the cover, we can see that the graphite chips are stacked in a double layer, covering almost all areas on the motherboard. This is designed to help dissipate heat. In addition, the 3400mAh battery takes up a lot of space.
After taking out the motherboard and battery, a U-shaped groove is found on the motherboard. This part is reserved for the hidden earphone unit.
The phone’s main rear camera uses a 12MP Sony IMX363 sensor, 1.4μm, and four-axis optical image stabilization. Its secondary rear camera uses a 12MP Samsung S5K3M3+ sensor.
It is the copper film on the back of the dual-rear camera setup.
After removing the motherboard, we found a large hole where the main chip was placed to help with better heat dissipation. However, such a design can cause difficulties in processing.
The most important components on the motherboard, including the CPU and RAM, are covered with nanometer carbon copper, which is compatible with heat dissipation and conductive functions. This material can solve both heat dissipation and shield problems.
It is the front of the motherboard. The white part on the left top corner is a voice-generating device of the ultrasonic distance sensor, and the semicircle part on the right is the receiver. The distance between the face and a phone can be calculated via a series of algorithms in this area.
It is the back of the motherboard.
Details of the motherboard’s back area
With the 8GB LPDDR4 memory chip removed, the Snapdragon 845 processor can be seen.
The hidden earphone uses a 50mv large core. It will work as an auxiliary component to the loudspeaker to increase the whole device’s volume.
Take out the earphones. It is the internal structure without the earphone.
Heat up and remove the front plate. A decoration bar is designed on the front plate to protect the LCD module and TP.
We found that this front plate uses PA high fiber with high intensity after using infrared spectroscopy to analyze it. Compared with glass fiber PC, PA has better hardness and size stability. Xiaomi adds this component to improve the full-screen phone’s hardness.
We can see the internal structure of the hidden earphone and ultrasonic distant sensor- three independent acoustic seal cavities.
It is a sound induction tube.
Front and rear camera
Front and rear camera size
Now, let’s take a look at the core components of the phone. Throughout the teardown, we found that the Xiaomi Mi MIX 2S applies some new designs to its internal structure thanks to its full-screen design. Placing an ultrasonic system, high-powered headphones, and dual rear cameras with OIS support in the cramped top space presents a great challenge for the phone.